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About the scholarship

  • Argentina, Brazil, Cambodia, China, Colombia, Denmark, Egypt, France, Germany, Ghana, Hong Kong, India, Japan, Jordan, Kenya, Korea, Republic of, Malaysia, Mexico, Mongolia, Nepal, Nigeria, Norway, Oman, Pakistan, Papua New Guinea, Peru, Philippines, Russian Federation, South Africa, Spain, Sri Lanka, Sweden, Switzerland, Taiwan, Province of China, Thailand, United Arab Emirates, United Kingdom, United States, Vietnam
  • Currently completing high school, Completed high school and applying for undergraduate studies, Postgraduate
  • Part-fee
  • Actuarial Science, Architecture and Built Environment, Business and Commerce, Communication and Creative Media, Health Sciences, Hotel and Tourism, International Relations and Humanities, Law, Social Sciences, Psychology and Counselling, Sport

Bond University offers undergraduate and postgraduate students who have outstanding leadership experience and community involvement with a partial-fee tuition remission scholarship. International Leadership Scholarships are awarded on the basis of academic excellence and evidence of outstanding leadership and community achievements.

Students must submit the Bond University Online Application Form before applying for this scholarship.

Once submitted, students can apply for this scholarship using the International Student Scholarship Application Form (PDF). The form must be completed in full and returned to [email protected] by the relevant application closing date.

A number of scholarships are provided each semester to international students commencing undergraduate or postgraduate studies at Bond University.

To be considered, applicants must:

  • Have submitted the Bond University Online Application Form to apply for chosen program. The following programs are not eligible for consideration for scholarships – Master of Psychology (Clinical), Master of Professional Psychology, Study Abroad and Exchange Programs, the Bond Medical Program and Doctor of Physiotherapy.
  • Have achieved a minimum of ATAR 84.00 or IB Diploma 30 (or equivalent) for undergraduate applicants, or achieved commendable results from undergraduate studies for postgraduate applicants
  • Evidence of your leadership, initiative, and service to your school/university and/or community. Please use the Summary of Achievements template to present this evidence and submit this along with your completed scholarship application form.
  • Complete and submit the International Student Scholarship Application Form (PDF) by the scholarship application closing date relevant to chosen starting semester.
  • Not have already commenced undergraduate or postgraduate studies at Bond University.
  • Those studying English at Bond University College as part of a packaged Offer are still eligible to apply.

Recipients of the International Leadership Scholarship are awarded with AUD$10,000 tuition remission and is paid in two equal AUD$5000 instalments in the recipient’s first two semesters of study.

The following programs are not eligible for consideration for the scholarships – Master of Psychology (Clinical), Master of Professional Psychology, Study Abroad and Exchange Programs, the Bond Medical Program and Doctor of Physiotherapy.

Following the closing date each semester, Bond will select the successful applicants on a competitive, merit-based process.

This will include review of each applicant’s academic achievement as demonstrated by their academic results from their home country qualification and supporting statement.

Incomplete applications will not be considered.

Successful applicants will be notified of the outcome within a month of the scholarship closing date.

Students must complete the Bond University Online Application Form before applying for this scholarship.

Once completed, students can apply for this scholarship using the International Student Scholarship Application Form (PDF). The form must be completed in full and returned to internationa[email protected] by the relevant application closing date.

  • First round applications closed on 30 June, 2020 for students commencing in September 2020 semester.
  • Second round applications close on 23 August, 2020 for students commencing in September 2020 semester.
  • Applications close on 16 October, 2020 for students commencing in January 2021 semester.

The successful award recipient must:

  • comply with Bond’s general scholarship terms and conditions
  • maintain a minimum average of 65% or better in each semester of their program
  • be enrolled on a full-time basis
  • participate in promotional activities arranged by the University.

Awards are non-transferrable and cannot be redeemed for cash.

Acceptance of the award implies agreement to meet these obligations.