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About the scholarship

  • Argentina, Bangladesh, Brazil, Cambodia, China, Colombia, Denmark, Egypt, France, Germany, Hong Kong, India, Japan, Jordan, Kenya, Korea, Republic of, Malaysia, Mexico, Mongolia, Nepal, Norway, Oman, Pakistan, Papua New Guinea, Peru, Philippines, Russian Federation, Singapore, Spain, Sri Lanka, Sweden, Switzerland, Taiwan, Thailand, Turkey, United Arab Emirates, United Kingdom, United States, Vietnam
  • Currently completing high school, Completed high school and applying for undergraduate studies, Postgraduate
  • Part-fee
  • Actuarial Science, Architecture and Built Environment, Business and Commerce, Communication and Creative Media, Health Sciences, Hotel and Tourism, International Relations and Humanities, Law, Social Sciences, Psychology and Counselling, Sport

Bond University offers ‘stand out’ students who are applying to study at an undergraduate or postgraduate level, with tuition remission scholarships. International Stand Out Scholarships are awarded on the basis of academic merit and are a testament to Bond University’s commitment to quality international students.

Students must submit the Bond University Online Application Form before applying for this scholarship.

Once submitted, students can apply for this scholarship using the International Student Scholarship Application Form (PDF). The form must be completed in full and returned to [email protected] by the relevant application closing date.

A number of scholarships are provided each semester to international students commencing undergraduate or postgraduate studies at Bond University.

To be considered, applicants must:

  • Have submitted the Bond University Online Application Form to apply for chosen program. The following programs are not eligible for consideration for scholarships – Master of Psychology (Clinical), Master of Professional Psychology, Study Abroad and Exchange Programs, the Bond Medical Program and Doctor of Physiotherapy.
  • Have achieved a minimum academic result of ATAR 89.00 or IB Diploma 32 (or equivalent) for undergraduate applicants or achieved ‘stand out’ academic results from undergraduate studies for postgraduate applicants.
  • Complete and submit the International Student Scholarship Application Form (PDF) by the scholarship application closing date relevant to chosen starting semester.
  • Not have already commenced undergraduate or postgraduate studies at Bond University.
  • Those studying English at Bond University College as part of a packaged Offer are still eligible to apply.

Recipients of the International Stand Out Scholarship are awarded with up to 25% tuition remission for their chosen program.

The following programs are not eligible for consideration for the scholarships – Master of Psychology (Clinical), Master of Professional Psychology, Study Abroad and Exchange Programs, the Bond Medical Program and Doctor of Physiotherapy.

Following the closing date each semester, Bond will select the successful applicants on a competitive, merit-based process.

This will include a review of each applicants’ academic achievement as demonstrated by their academic results from their home country qualification and supporting statement.

Incomplete applications will not be considered.

Successful applicants will be notified of the outcome within a month of the scholarship closing date.

Students must submit the Bond University Online Application Form before applying for this scholarship.

Once submitted, students can apply for this scholarship using the International Student Scholarship Application Form (PDF). The form must be completed in full and returned to internation[email protected] by the relevant application closing date.

  • Applications closed on 23 August, 2020 for students commencing in September 2020 semester.
  • First round applications closed on 16 October, 2020 for students commencing in January 2021 semester.
  • Second round applications close on 22, November, 2020 for students commencing in January 2021 semester.
  • The remaining 2021 semester application closing dates will be released soon.

The successful award recipient must:

  • comply with Bond’s general scholarship terms and conditions
  • maintain a minimum average of 65% or better in each semester of their program
  • be enrolled on a full-time basis
  • participate in promotional activities arranged by the University.

Awards are non-transferrable and cannot be redeemed for cash.

Acceptance of the award implies agreement to meet these obligations.