About the scholarship

  • Latin America
  • Postgraduate
  • Part-fee

Bond University offers high achievers from Latin America with tuition remission scholarships. These scholarships are awarded on the basis of academic excellence and are a testament to Bond University’s commitment to quality and outstanding international students.

Students must complete the Bond University Online Application Form to receive their program offer before applying for this scholarship.

Once an offer has been received, students must complete the Latin America Postgraduate Scholarship Application Form. The form must be completed in full and returned to [email protected] by the relevant application closing date.

  • Applications close on 19 October, 2018 for students commencing in January 2019 semester.
  • Applications close on 25 January, 2019 for students commencing in May 2019 semester.
  • Applications close on 24 May, 2019 for students commencing in September 2019 semester.

Download a copy of the Latin America Postgraduate Scholarship information flyer.

A number of scholarships are provided each semester to students from Latin America, commencing postgraduate studies at Bond University.

To be considered, applicants must:

  • Have already received an offer from Bond University to commence a postgraduate degree. Students who have not yet received an offer can apply via the Bond University Online Application Form. The following programs are not eligible for consideration for scholarships – Master of Psychology, Study Abroad and Exchange Programs, Bond Medical Program and Doctor of Physiotherapy.
  • Be a citizen of a Latin American country and be currently residing in Latin America.
  • Have outstanding academic ability.
  • Complete and submit the Latin America Excellence Scholarship Application Form by the scholarship application closing date relevant to chosen starting semester.
  • Not have already commenced postgraduate studies at Bond University.

The Latin America Postgraduate Scholarship awards AUD$10,000 tuition remission and is paid in two equal AUD$5000 installments in the recipient’s first two semesters of study.

Following the closing date each semester, Bond will select the successful applicants on a competitive, merit-based process.

This will include a review of each applicant’s achievements as demonstrated by their academic results from their previous home country qualifications as well as their community involvement and other achievements as evidenced in their supporting statement.

Incomplete applications will not be considered.

Successful applicants will be notified of the outcome within a month of the scholarship closing date.

Students must complete the Bond University Online Application Form to receive their program offer before applying for this scholarship.

Once an offer has been received, students must complete the Latin America Postgraduate Scholarship Application Form. The form must be completed in full and returned to [email protected] by the relevant application closing date.

  • Applications close on 19 October 2018 for students commencing in January 2019 semester.
  • Applications close on 25 January, 2019 for students commencing in May 2019 semester.
  • Applications close on 24 May, 2019 for students commencing in September 2019 semester.

The successful award recipient must:

  • Comply with Bond’s general scholarship terms and conditions
  • Maintain a minimum average of 65% or better in their program
  • Be enrolled on a full-time basis
  • Participate in promotional activities arranged by the University.

Awards are non-transferrable and cannot be redeemed for cash.

Acceptance of the award implies agreement to meet these obligations.